High-precision multi-focus laser sculpting of microstructured glass
微结构玻璃的高精度多焦点激光雕刻
微細構造ガラスの高精度多焦点レーザー彫刻
마이크로 구조 유리의 고정밀 다초점 레이저 조각
Grabado láser multifocal de alta precisión de vidrio microestructural
Gravure laser multifocale de haute précision sur verre microstructuré
Высокоточная многофокусная лазерная гравировка микроструктурированного стекла
Kang Xu 徐康 ¹, Peilin Huang 黄沛霖 ¹, Lingyu Huang 黄凌羽 ¹, Li Yao 姚丽 ¹, Zongyao Li 李宗尧 ¹, Jiantao Chen 陈剑涛 ¹, Li Zhang 张立 ², Shaolin Xu 徐少林 ¹
¹ Department of Mechanical and Energy Engineering, Southern University of Science and Technology, 1088 Xueyuan Avenue, Shenzhen 518055, China
中国 深圳 南方科技大学机械与能源工程系
² Guangdong Provincial Engineering and Technology Research Center for Ultrafast Laser Micro-Nano Manufacturing Equipment and Technology, Shenzhen Guihua Intelligent Technology Co., Ltd., Shenzhen 518109, China
中国 深圳 深圳市圭华智能科技有限公司 广东省超快激光微纳制造装备与工艺工程技术研究中心
Precision sculpting of glass with defined surface microstructures is vital due to the miniaturization and integration of glass-based devices, while it is still challenging as the high brittleness of glass. We here create a three-dimensional multi-focus laser for glass micro-sculpting through a beam-shaping technology based on the superposition of lens and grating phase diagrams.
The multi-focus laser modification in tandem with chemical etching enables the fabrication of glass microstructures with highly adjustable profiles. Refractive-index-induced deviations are migrated via algorithm correction to ensure multi-focus positional accuracy. Energy un-uniformity due to equidistant laser spots arrangement is eliminated through their coordinate randomization following the target profiles.
Finally, uniform laser spots with a proper point-to-point distance create connected cracks inside glass, enabling efficient etching with enhanced rates along the modified profile and the fabrication of surface microstructures. We demonstrate diverse groove arrays with profiles of trapezoid, semicircle, and triangle, revealing low roughness around 1.3 μm, a high depth-width ratio of 3:1, and depth up to 300 μm, which underscore broad applications such as fiber packaging.
